Imaging structure emitter calibration

ABSTRACT

In embodiments of imaging structure emitter calibration, an imaging unit includes an emitter structure that direct emits light, and optics direct the light along a light path in the imaging unit to illuminate a projection surface. A reflective panel reflects a portion of the light to illuminate a light sensor. An imaging application receives the sensor data from the light sensor, where the sensor data corresponds to emitted light output from the emitter structure. The imaging application can then initiate a calibration input to the emitter structure to adjust the emitted light output from the emitter structure.

BACKGROUND

Virtual reality can be viewed as a computer-generated simulated environment in which a user has an apparent physical presence. A virtual reality experience can be generated in 3D and viewed with a head-mounted display (HMD), such as glasses or other wearable display device that has near-eye display panels as lenses to display a virtual reality environment, which replaces the actual environment. Augmented reality, however, provides that a user can still see through the display lenses of the glasses or other wearable display device to view the surrounding environment, yet also see images of virtual objects that are generated for display and appear as a part of the environment. Augmented reality can include any type of input such as audio and haptic inputs, as well as virtual images, graphics, and video that enhances or augments the environment that a user experiences. As an emerging technology, there are many challenges and design constraints with augmented reality, from generation of the virtual objects and images so that they appear realistic in a real environment, to developing the optics small and precise enough for implementation with a wearable display device. There are also challenges to developing illumination sources for implementation as micro projectors and/or imaging units for wearable display devices.

Conventional LCOS (liquid crystal on silicon) projection technologies use an LED (light emitting diode) or laser source to generate light that is reflected off of a silicon transistor array covered by an LCD (liquid crystal display) material to either reflect and/or change the polarization of the light. The LCOS reflective technology uses liquid crystals instead of individual micro-mirror array MEMS (micro-electro-mechanical systems) mirrors. The liquid crystals are applied to a reflective mirror substrate and, as the liquid crystals open and close, the light is either reflected from the mirror below or blocked to modulate the emitted light. LCOS-based projectors typically use three LCOS chips, one each to modulate the red, green, and blue (RGB) components of the light. Similar to an LCD projector which uses three LCD panels, both LCOS and LCD projectors simultaneously project the red, green, and blue components of the light, such as for display on a display screen. A conventional display technology utilizes OLEDs (organic light emitting diodes) that generate light when current is applied through layers of the organic material. Although OLED cells can be individually controlled for illumination, unlike the LCOS material, the OLEDs are not viable for projection illumination because they do not emit enough light.

Some conventional LED array scanning systems for display technologies that have large optical systems are typically too large and complex to be implemented in imaging units for wearable display devices. Limitations of the current technology include the ability to modulate the emitters in sequence in a scanning system, which can result in a slow refresh rate, a blurred image quality, and/or limited color depth. Another limitation of conventional LED array scanning systems is the relatively larger pitch between the LED emitters, which results in a larger optical system with size and weight barriers to implementation in a consumer HMD product. The light that is emitted for LED array scanning is moved across a surface, such as via a MEMS mirror, LC scanner, or by moving optics. However, the light efficiency of each emitter can vary based on production and material variances, bonding issues, connectivity issues, driver variance, micro-optics, color conversion variance, temperature, and/or optic differences across the surface.

A number of correction techniques can be applied to drive each emitter with a correction curve to adjust for light efficiency variances. However, many of the correction curves are determined during manufacture and cannot be adjusted during use. Testing during production and manufacture can also be difficult and expensive because each emitter is tested at various emission points. Unlike conventional display devices, line and/or block scanning displays can exhibit display anomalies due to emitter light efficiency variances because any errors are also scanned over the display surface. For example, a single pixel failure in a conventional display may not be noticeable in a production device, whereas an error in a scanning device may result in an entire row of pixels being lost or displaying the incorrect light intensity level.

SUMMARY

This Summary introduces simplified concepts of imaging structure emitter calibration, and the concepts are further described below in the Detailed Description and/or shown in the Figures. This Summary should not be considered to describe essential features of the claimed subject matter, nor used to determine or limit the scope of the claimed subject matter.

Imaging structure emitter calibration is described. In embodiments, an imaging unit includes an emitter structure that direct emits light, and optics direct the light along a light path in the imaging unit to illuminate a projection surface. A reflective panel reflects a portion of the light to illuminate a light sensor. An imaging application receives the sensor data from the light sensor, where the sensor data corresponds to emitted light output from the emitter structure. The imaging application can then initiate a calibration input to the emitter structure to adjust the emitted light output from the emitter structure.

In other embodiments, the emitter structure is implemented as individual embedded light sources that direct emit the light, and the individual embedded light sources cycle to emit the light one at a time. The light sensor can be implemented as a linear array of light detectors, and the imaging application receives the sensor data from the linear array of light detectors. The imaging application can then compute a correction value for each of the individual embedded light sources of the emitter structure over a time duration, and initiate the calibration input for each individual embedded light source. The calibration input adjusts the emitted light output from the individual embedded light sources, and also corrects for operational conditions that affect the emitted light output from the emitter structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of imaging structure emitter calibration are described with reference to the following Figures. The same numbers may be used throughout to reference like features and components that are shown in the Figures:

FIG. 1 illustrates examples of imaging structures with embedded light sources in accordance with one or more embodiments.

FIG. 2 illustrates examples of imaging units in accordance with one or more embodiments of imaging structure emitter calibration.

FIG. 3 illustrates an example system in which embodiments of imaging structure emitter calibration can be implemented.

FIG. 4 illustrates an example system that includes an example of a wearable display device in which embodiments of imaging structure emitter calibration can be implemented.

FIG. 5 illustrates example method(s) of imaging structure emitter calibration in accordance with one or more embodiments.

FIG. 6 illustrates various components of an example device that can implement embodiments of imaging structure emitter calibration.

DETAILED DESCRIPTION

Embodiments of imaging structure emitter calibration are described. An imaging structure can be formed in inorganic material and implemented for individual cell control (e.g., individual pixel control), where each cell is a direct emitter designed to emit a bright output of light that can be used for a number of optical solutions, such as with light guides, waveguides, projection, and/or free form optics solutions. For example, light that is emitted from the embedded light sources (e.g., RGB iLEDs or lasers) can be reflected through a micro lens optic and then directed in an imaging system of a wearable display device (e.g., glasses or a head-mounted display), such as reflected off of a MEMS mirror and then directed into a waveguide or otherwise projected.

In embodiments, imaging structure emitter calibration provides a technique to continuously monitor and correct emitted light levels from the embedded light sources in an imaging structure for one-dimensional and two-dimensional scan display solutions. An imaging structure can be implemented with red, green, and/or blue (RGB) embedded light sources, such as lasers, iLEDs, or OLEDs in various one-dimensional (1D), two-dimensional (2D), or n-dimensional arrays, structures, and configurations. A one-dimensional or two-dimensional array of the embedded light sources in an imaging structure can each be independently driven for a specific value at a particular time, which allows calibration over time of the entire array of emitters.

Sensor results can be used to compute future correction values for each individual embedded light source in the emitter structure. Additionally, operational variances for temperature, ambient light, and other environmental and operational conditions can be applied for all of the pixels, as well as monitored and adjusted over time. Embodiments of imaging structure emitter calibration provides for initial testing of the emitters in the emitter structure followed with any sequence of specific testing to generate a more accurate correction to adjust the light output from the individual emitters.

While features and concepts of imaging structure emitter calibration can be implemented in any number of different devices, systems, environments, and/or configurations, embodiments of imaging structure emitter calibration are described in the context of the following example devices, systems, and methods.

FIG. 1 illustrates examples 100 of an imaging structure with embedded light sources in accordance with one or more embodiments. An imaging structure 102, similar to a transistor array, has material layers that form the embedded light sources 104 of the imaging structure to directly emit light. For example, inorganic LED (iLED) material can be utilized that produces greater luminescence than typical OLED micro-display solutions which are principally limited to low light scenarios. However, embodiments of imaging structure emitter calibration can be implemented for OLED micro-display solutions. In this example 100, the imaging structure 102 is constructed with a silicon backplane layer 106, a driver pad array 108, an emitter material layer 110, and a conductive material layer 112 that may be implemented as a common layer or pixel specific layer that is transparent, a ground plane, a metal layer, a power conductive layer, and/or as another type of material or configuration of materials.

The embedded light sources 104 are formed as individual emitters on the driver pad array in the emitter material layer, and the embedded light sources can be individually controlled at the driver pad array. The emitter material layer 110 can include a reflective structure 114, such as formed in a reflective array that is embedded or etched, for LED pixel isolation and reflective collection of photons (e.g., pseudo parabolic collection) towards an ideal light exit plane. The emitter material layer includes the reflective structure 114 to reflect the light to exit the individual direct emitters. Alternatively or in addition to the reflective structure 114, the imaging structure 102 can include other techniques, such as pyramid and/or cylindrical structures, to improve the optical extraction of the light. Implementations of color conversion may also be applied to the surfaces of the reflective, pyramid, and/or cylindrical structures.

The conductive material layer 112 can be formed with a rough surface 116 that is designed to allow more light emission out from the emitter material layer rather than be reflected or dispersed. Additionally, the material used to form the conductive material layer 112 can be formed around the sides of the individual LED zones. In embodiments, a p-n junction 118 is formed between the emitter material layer 110 and the conductive material layer, where one of the emitter material layer or the conductive material layer is a p-type semiconductor and the other is an n-type semiconductor. The conductive material layer 112 can be implemented as a transparent, common ground plane at the top of the imaging structure for electron flow through the p-n junction 118 as a transparent conductor. Alternatively, two separate layers with an insulation layer can be implemented to allow reflection on a lower layer with no connectivity, and allow reflection on an upper layer with connectivity.

In the imaging structure 102, multiple points between the p-type and the n-type semiconductor materials can be connected (e.g., strapped) for overall efficiency and to improve conductance. The imaging structure is unique for LEDs in that light is not emitted over the whole surface of the imaging structure. For micro-lens efficiency, point source emission can be implemented, and the emitting area can be well under 50% (e.g., such as 10%). Accordingly, the conductive material layer 112 may not be implemented as transparent conductor material, but rather as metal around the emitting area to strap down the p-type material to ground. Alternatively or in addition, TSV-like channels can be utilized to the top of the p-type material for either a pixel driver or for ground. When the structures are implemented as diodes, and depending on which way the p-n junction is layered and how the ground and active are wired, various configurations can be implemented.

In embodiments, the imaging structure 102 can be implemented as inorganic LEDs (iLEDs) on the silicon backplane layer 106 to drive line-scanned or pico-projection devices without using an additional LCOS imager. The imaging structure is also implemented for per-pixel color illumination (rather than full-display) for illumination efficiency and minimal light loss. The imaging structure 102 can be implemented with red, green, and/or blue (RGB) embedded light sources, such as lasers or LEDs, in various one-dimensional (1D), two-dimensional (2D), or n-dimensional arrays, structures, and configurations. Alternatively, the imaging structure 102 can be implemented with OLEDs (formed from organic material) in various one-dimensional (1D), two-dimensional (2D), or n-dimensional arrays of the embedded light sources.

For example, a 1D array imaging structure 120 is formed with red 122, green 124, and blue 126 embedded light sources (e.g., iLEDs or lasers) that are formed with different materials for each different color. In another example, a 2D array imaging structure 128 is formed with two each RGB embedded light sources, and as indicated, may include additional embedded light sources along an X and/or Y axis of the 2D array. In embodiments of imaging structure emitter calibration, a 2D array of embedded light sources can formed with OLEDs or iLEDS. In an example implementation, a 2D array of embedded light sources can include a blue array from blue LED material, a red array from red LED material, and a green array from green LED material. In other embodiments, the imaging structure 102 can be formed as base structure with one material in a single color, such as blue, and then a color conversion layer can be utilized over the imaging structure to convert green and red from the blue base.

The silicon backplane layer 106 of the imaging structure 102 receives serial or parallel data which is used to drive associated pixels, such as for example, at speeds of 30 Hz to 60 Hz, or at faster frame rates. In alternate configurations, the imaging structure 102 may be implemented without the silicon backplane layer 106, in which case the embedded light sources can be initiate passively with data and select lines, such as driver by line driver chips (similar to those used in display devices, for example). In a 1D configuration (e.g., the 1D array imaging structure 120), an image is generated over time by driving a line of pixels x-number of times per frame. Alternatively, sets of lines can be driven to generate a frame of an image, or entire frames of the image, at one time. Any of the various arrays and configurations can be selected based on intended light levels, timing to scan lines, and illumination efficiency.

Each of the embedded light sources can be individually controlled by the driver pad array 108 (also referred to as the control plane), and can be illuminated in a variety of patterns based on analog, current modulation, pulse-width modulation (PWM), and/or based on specific time and power parameters. The iLED, OLED, or laser arrays then generate either multiple colors (1D×RGB or 2D×RGB) or single color (UV or blue) with additional color conversion layers, which may include a layer of Quantum Dots (QDs). An additional, optional layer or set of layers can be implemented to leverage LC (liquid crystal) materials to direct, redirect, and/or focus the light that is emitted from the imaging structure array. In embodiments, the embedded light sources are implemented as lasers with a surface emitting laser array or a VCSEL (vertical-cavity surface-emitting laser). An example implementation may include LED material in the center of multiple Bragg reflective layers at one-quarter wavelength apart, and the LEDs create the initial photons that lase in a chamber formed by the Bragg layers.

The driver pad array 108 is implemented for current-based modulation (rather than a voltage-based LCOS) to drive the individual embedded light sources, such as iLEDs or lasers (rather than previously utilized LC material). The driver pad array 108 can have exposed metal pads to directly drive the LED array electrically (e.g., a current-based LED drive) and optically (e.g., an exposed metal pad utilized as a reflector). The connections from the driver pad array 108 to the emitter material layer 110 can be implemented by various techniques, such as TSV (through-silicon via), as deposited material, or layered 1D or 2D iLED structures on top of the control plane (e.g., the driver pad array 108), where the pixels are the rows or grids of the iLEDs. These connections allow control of voltage and/or current for controlling light illumination from the imaging structure array.

An example imaging structure 130 can be implemented as a fault tolerant array used to avoid yield loss of illumination when single pixel zones fail. The imaging structure 130 is formed as an array of nine embedded light sources (e.g., iLEDs) in three sections, with three red 132, three green 134, and three blue 136 embedded light sources. After production, a test can be used to determine weak or faulty light source sectors, which can then be marked for non-use in a final LED scan controller. Additionally, if one embedded light source of a section fails, the illumination intensity of the other two embedded light sources in the section can be increased, such as with gamma correction for non-linear illumination, to calibrate for the failed light source.

Other imaging structure configurations can also be utilized as a fault tolerant array, such as with two pixels per sub-pixel (e.g., a 2D array of six embedded light sources with two red, two green, and two blue embedded light sources), or an array of embedded light sources with more than three pixels per color. Other imaging structure configurations can be implemented with multiple sets of LED arrays that are positioned, or otherwise fit, extremely close to one another to avoid having multiple LEDs per pixel. Any number of configuration patterns are also possible, such as a 2D array, four square blocks, a 2×4 configuration, or any other n×m configuration that allows for smaller array yields.

FIG. 2 illustrates examples 200 of imaging units in embodiments of imaging structure emitter calibration. An imaging unit 202 includes a printed circuit board 204 that incorporates an emitter structure 206 (also referred to herein as an imaging structure). The emitter structure 206 can be implemented as any of the example imaging structures described with reference to FIG. 1, such as the one-dimensional imaging structure 120 with RGB embedded light sources, or as the example two-dimensional imaging structure 128. As noted, the emitter structure 206 can be implemented with lasers, iLEDs, or OLEDs in various one-dimensional (1D), two-dimensional (2D), or n-dimensional arrays of the embedded light sources. The emitter structure can be implemented as individually controlled embedded light sources that direct emit the light 208, and the individual embedded light sources cycle to direct emit the light one at a time. In implementations, the embedded light sources are formed in inorganic material as one of lasers or iLEDs to direct emit the light, such as described with reference to FIG. 1. The lasers and LEDs tend to operate at far higher speeds than the pixel rates that may be used, which can allow testing over a range of emissions. The array of emitters (e.g., the embedded light sources) are modulated based on position of a scanning mirror, or similar implementation.

The imaging unit 202 includes optics that direct the light along a light path in the imaging unit. For example, the emitter structure 206 direct emits the light, which is reflected by a reflecting mirror 210 to illuminate a projection surface 212, such as a MEMS scanning mirror (e.g., or other electrically alterable mirror) that is also incorporated with the printed circuit board 204. The imaged light is then directed by the projection surface through an imaging optic 214 that directs the light into a display optic 216, such as a see-through, reflecting waveguide. The light emitted from the emitter structure (e.g., lasers or iLEDs) is directed into an emission cone, and the light diverges to the projection lens, which then collimates the beam to form a virtual object for viewing, such as for a wearable display device or other near-to-eye display.

In embodiments, the imaging unit 202 also includes a light sensor 218 that is positioned proximate the projection surface 212 in the imaging unit. A reflective panel 220, such as a Fresnel mirror, is positioned to reflect a portion of the light at a collection lens 222 to illuminate the light sensor. The Fresnel mirror can include facets that direct the light to the detector, and the signal on the calibration sensor (e.g., the light sensor) is then used to calibrate each emitter in the array. In implementations, the light sensor may be a linear array of light detectors positioned along one or more edges of the projection surface 212. In other implementations, the light sensor can be positioned anywhere in the imaging unit 202 for an optical view of the emitter structure 206.

Alternatives to the reflective panel 220 (e.g., a Fresnel mirror) that directs the light to illuminate the light sensor 218 can be implemented to collect the light. For example, the light can be detected from the display optic 216 (e.g., a waveguide) when the light is sensed from one LED pixel of the emitter structure 206 at a time, and/or from one or more partially reflecting (non-100%) mirrors implemented in the light path. Other techniques may also be implemented to sense the light output from the embedded light sources of the emitter structure, such as with sensors that are positioned outside of the projection or light guide system. In other implementations of imaging structure emitter calibration, quantum dots (QDs), such as an IR QD, may be implemented to convert some of the light to IR to be detected by an IR detector. For example, larger QDs (like 10 nm) will have a wide input wavelength capability, and an emitter can be converted to a single receiver when the light that is generated within the emitter structure array can be detected at the position of the detector.

Other sensors for ambient light, temperature, brightness of the image that is being presented, etc. can also be used in conjunction with the light emission measurements at the light sensor, and global corrections can be applied. For example, the effects of temperature on the emitter structure can be measured to form global corrections per device or imaging unit. Further, one or more individual emitters (e.g., embedded light sources) can be tested concurrently depending on the type of sensor implementation.

As shown in the imaging unit 202, the light sensor 218 is positioned at an outside edge of the projection surface 212 and incorporated with the printed circuit board 204. In an alternate embodiment, an imaging unit 224 includes the light sensor 218 positioned between the projection surface 212 and the emitter structure 206. To avoid a loss of display surface, the areas outside of the display area are used, but leverage areas within the limits of the scan device. A MEMS (or similar systems) may have dead areas at the ends of the scan where scan speeds are less deterministic. Implementations of imaging structure emitter calibration utilize sensors with far greater size than the pixel sizes, which allows for calibration in these dead zones.

As described with reference to FIGS. 3 and 4, a wearable display device (e.g., glasses or a head-mounted display) can be implemented with left and right display lens systems that each include an embodiment of an imaging unit, such as the imaging unit 202 or the imaging unit 224. The wearable display device and/or a controller unit of the wearable display device implements an imaging application, such as a software application, to implement embodiments of imaging structure emitter calibration as described herein. Examples of controller units that can implement an imaging application for a wearable display device are described with reference to FIG. 4.

In embodiments, the imaging application is implemented to receive sensor data from the light sensor 218, or from a linear array of light detectors, where the sensor data corresponds to the emitted light output from the emitter structure (e.g., an array of embedded light sources). The imaging application can then compute a correction value for each of the individual embedded light sources of the emitter structure over a time duration, and initiate a calibration input to the emitter structure to adjust the emitted light output for each individual embedded light source. The calibration input adjusts the emitted light output from the individual embedded light sources, and also corrects for environment and/or operational conditions that affect the emitted light output from the emitter structure, such as temperature, ambient light, and other environmental or operational conditions. A calibration of the emitter structure 206 can also be implemented during manufacturing to determine initial parameters for offsets based on distance to detector or optical differences. This provides the post-manufacturing calibration process with a basis for differences in the specific device for on-going, post-manufacturing calibrations.

In a one-dimensional line-scanning example, an array of emitters, such as 1024 embedded light sources in the emitter structure 206, can be scanned over 1280 discrete positions to create a 1280×1024 pixel solution. An array of nine emitters, such as the imaging structure 130 shown in FIG. 1 with nine emitters (e.g., three red, three green, and three blue embedded light sources) per pixel may have only two of the three emitters per color operational as determined after manufacturing. The light sensor 218 can be illuminated during the traditional dead time that the mirror or other mechanism is turning direction. For example, a simple three color sensor can be implemented for the example three-sub pixels emitter structure. Larger sensor sizes can also be implemented for multiple emitter testing. Alternatively or in addition, multiple sensors may be implemented, such as on both sides of the projection surface 212 to reduce calibration times. In implementations, the light emission from the emitter structure 206 is measured by the sensor per color, but other sensor types can also be used to include other measurements for color accuracy, blur, etc.

Continuing the example implementation, a single emitter set of all three colors can be turned on to emit light with a modulated pattern in the dead time, and sequence through each pixel in the scan row every time the scan array reaches the dead zone where the sensor is placed. Accordingly, calibration in this example can be 1024 sequences of the scan array to obtain values from every pixel. Assuming a 60 Hz system and a sensor on one side of the projection surface, it may take 1024/30 seconds to obtain a value for every pixel, which is well within acceptable calibration times. The sensor data is received by the imaging application, and a modulated test signal represents a sequence of emission values that are used for a correction curve (e.g., fully analog, piece-wise linear, or discrete points) to adjust the emitted light output for each individual emitter of the emitter structure. For emitters that have failed in fault tolerant solutions, combinations of emitters per color per pixel can be used, and follow-up testing when failures are found can be used. Embodiments of imaging structure emitter calibration provides for initial testing of the emitters followed with any sequence of specific testing to generate a more accurate correction or curve per pixel.

FIG. 3 illustrates an example system 300 in which various embodiments of imaging structure emitter calibration can be implemented. An example wearable display device 302 includes left and right display lens systems, such as display lens systems 304 that are viewed from a perspective 306 of the wearable display device, as if viewing the display lens systems from the top of the device. In embodiments, the display lens systems 304 can be implemented as left and right display lens systems of the wearable display device described with reference to FIG. 4. A wearable display device can be implemented as any type of glasses or head-mounted display (HMD) that includes implementations of the display lens systems 304 (e.g., left and right display lens systems) through which a user can view the surrounding environment, yet also see virtual images that are generated for display and appear as a part of the environment. References to a left imaging system and a right imaging system, as described herein, correlate to a user's left and right eyes (e.g., from the perspective of wearing and looking through the wearable display device). Alternatively, the left and right imaging systems may be described from the perspective of looking at the wearable display device.

The display lens systems 304 include a display optic 308, such as a see-through and reflecting waveguide, through which light 310 of an image (e.g., an image of the environment as viewed through the wearable display device) is projected for viewing. In this example, the display lens systems 304 include examples of the imaging unit 202 (as shown in FIG. 2), which can be implemented with any number of micro display panels, imaging structures with direct emitters, lenses, and reflecting elements to display and project a virtual image into a see-through and reflecting waveguide. Alternatively, the display lens systems 304 can be implemented with the example imaging unit 224, or other imaging unit configurations. The see-through, reflecting waveguide (i.e., the display optic 308) is implemented for internal reflection and conducts visible light of a virtual image that is generated by the imaging unit 202 for viewing by a user, and also passes through the light 310 from the surrounding environment for viewing by the user. A display lens system 304 with an imaging unit can also be implemented with components of the display lens system described with reference to FIG. 4 to implement embodiments of imaging structure emitter calibration.

In embodiments, the imaging units 202 of the display lens systems 304 each include the printed circuit board 204 that incorporates the emitter structure 206, such as the one-dimensional imaging structure 120 (described with reference to FIG. 1) with RGB embedded light sources, or the example two-dimensional imaging structure 128. The emitter structure 206 direct emits the light, which is reflected by the reflecting mirror 210 to illuminate the projection surface 212, such as a MEMS scanning mirror (e.g., or other electrically alterable mirror) that is also incorporated with the printed circuit board 204. The imaged light is then directed by the projection surface through the imaging optic 214 that directs the light into the display optic 308. The imaging unit 202 also includes the light sensor 218 that is positioned proximate the projection surface 212 in the imaging unit. The reflective panel 220, such as a Fresnel mirror, is positioned to reflect a portion of the light at the collection lens to illuminate the light sensor.

FIG. 4 illustrates an example system 400 that includes an example wearable display device 402 in which embodiments of imaging structure emitter calibration can be implemented. The wearable display device can be implemented as any type of glasses or head-mounted display (HMD) that includes display lens systems 404 (e.g., left and right display lens systems) through which a user can view the surrounding environment, yet also see virtual images (e.g., any type of object, video, text, graphic, and the like) that are generated for display and appear as a part of the environment.

The wearable display device 402 can be implemented as an independent, portable system that includes memory, software, a processor, and/or a power source. Alternatively or in addition, the wearable display device may be communicatively linked to a controller 406 that includes any one or combination of the memory, software, processor, and/or power source, such as a battery unit. The controller can be implemented for wired or wireless communication with the wearable display device. The controller and/or the wearable display device can also be implemented with any number and combination of differing components as further described with reference to the example device shown in FIG. 6. For example, the controller and/or the wearable display device includes an imaging application implemented as computer-executable instructions, such as a software application, and executed by a processor to implement embodiments of imaging structure emitter calibration as described herein.

In embodiments, the controller may be implemented as a dedicated device (e.g., the wired controller 406), as a mobile phone 408, a tablet or other portable computer device, a gaming system 410, or as any other type of electronic device that can be implemented to process and generate virtual images for display as part of the environment that is viewed through the display lens system of the wearable display device. The controller may communicate with the wearable display device wirelessly via WiFi™, Bluetooth™, infrared (IR), RFID transmission, wireless Universal Serial Bus (WUSB), cellular, or via other wireless communication techniques.

The example system 400 also includes a data server 412, or data service, that communicates, or otherwise distributes, virtual image data 414 to the wearable display device 402 via a communication network 416. For example, the data server may be part of a network-based gaming system that generates virtual images for augmented reality display at the wearable display device. Alternatively, the data server may be part of a navigation system that communicates navigation directions and information for display in the display lens systems 404 of the wearable display device. In another example, the data server may be part of a messaging service, such as an e-mail or text messaging system, that communicates e-mail and/or text messages to the wearable display device for display in the display lens systems, where a user can read a message as an augmented reality image that is displayed over the environment viewed through the wearable display device.

Any of the devices, servers, and/or services can communicate via the communication network 416, which may be implemented to include wired and/or wireless networks. The communication network can also be implemented using any type of network topology and/or communication protocol, and can be represented or otherwise implemented as a combination of two or more networks, to include IP-based networks and/or the Internet. The communication network may also include mobile operator networks that are managed by mobile operators, such as a communication service provider, cell-phone provider, and/or Internet service provider.

The wearable display device 402 includes a frame 418, such as in the form of glasses, goggles, or any other structure, that supports and incorporates the various components of the device, as well as serves as a conduit for electrical and other component connections. A components module 420 (or components modules on the left, right, and/or both sides of the device frame) incorporates any of the various components, such as processing and control circuitry, memory, software, a processor, GPS transceiver, and/or power source. The wearable display device may also include a microphone 422 to record audio data from the surrounding environment, as well as ear phones for audio feedback as part of an augmented reality experience.

The wearable display device 402 also includes various cameras 424 that capture video and still images of the surrounding environment. The image and video data can be processed on the device and/or by a controller device (e.g., controller 406), and used to create a mapping field to orient and track a user in the environment space. The wearable display device can also include eye tracking cameras used to determine a user's eyeball location and track eye movements. The wearable display device may also include a temperature sensor, as well as inertial sensors and/or attitude sensors, including MEMS gyros, magnetic sensors (e.g., a compass), and acceleration sensors for sensing position, orientation, and acceleration of the wearable display device.

An example of one display lens system 404 is shown from a viewer perspective 426 of the wearable display device 402, as if viewing the display lens system from the top of the device. The display lens system includes an imaging system 428, which can be implemented with any number of micro display panels, lenses, and reflecting elements to display and project a virtual image into a see-through and reflecting waveguide 430. A display lens system 404 can also be implemented as the imaging units described with reference to FIG. 3 to implement embodiments of imaging structure emitter calibration. The see-through, reflecting waveguide 430 is implemented for internal reflection and conducts the visible light 432 of a virtual image that is generated by the imaging unit for viewing by a user, and also passes through the light 434 from the surrounding environment for viewing by the user.

The micro display panels, lenses, and/or reflecting elements of the imaging system 428 can be implemented with various display technologies, such as implemented with a transparent LCD, or using a transmissive projection technology where the light source is modulated by optically active material, backlit with white light. These technologies can be implemented using LCD type displays with powerful backlights and high optical energy densities. Alternatively, a micro display and/or reflecting element can be implemented using a reflective technology, such as digital light processing (DLP) and liquid crystal on silicon (LCOS), that reflects external light, which is reflected and modulated by an optical material.

In embodiments, the imaging system 428 (or other components of a display lens system 404) can be implemented to include an infra-red (IR) laser utilized for system calibrations and/or as an illumination source for an eye-tracking system and camera that tracks the position of a user's eyes. The eye-tracking system includes the eye-tracking illumination source, which is not a visible light, and includes an eye-tracking IR sensor. In implementations that include color conversion, the illumination source can be implemented as UV or blue iLED arrays, and a color conversion implemented to emit IR light from one or more of the pixels. The IR sensor can be implemented as an IR camera that provides infrared image data of the eye for eye-tracking processing, or an IR sensor that detects eye reflections when the eye is illuminated. Alternatively or in addition, sensors can be implemented in the CMOS driver array to detect the feedback. In implementations, the light reflections (e.g., the IR return) may be directed with SBG or SRB methods. The see-through and reflecting waveguide 430 can also be utilized for the infrared illumination, and for eyeball reflections that the eye-tracking system uses to track the position of the user's eyes.

In this example, the display lens systems 404 include an optional opacity filter 436, and a see-through lens 438 on each side of the waveguide 430. The see-through lenses can be standard eye-glass lenses and made to prescription (or no prescription). The opacity filter selectively blocks natural light, either uniformly or on a per-pixel basis, from passing through the see-through and reflecting waveguide to enhance the contrast of a displayed virtual image.

Example method 500 is described with reference to FIG. 5 in accordance with one or more embodiments of imaging structure emitter calibration. Generally, any of the services, functions, methods, procedures, components, and modules described herein can be implemented using software, firmware, hardware (e.g., fixed logic circuitry), manual processing, or any combination thereof. A software implementation represents program code that performs specified tasks when executed by a computer processor. The example methods may be described in the general context of computer-executable instructions, which can include software, applications, routines, programs, objects, components, data structures, procedures, modules, functions, and the like. The program code can be stored in one or more computer-readable storage media devices, both local and/or remote to a computer processor. The methods may also be practiced in a distributed computing environment by multiple computer devices. Further, the features described herein are platform-independent and can be implemented on a variety of computing platforms having a variety of processors.

FIG. 5 illustrates example method(s) 500 of imaging structure emitter calibration. The order in which the method blocks are described are not intended to be construed as a limitation, and any number of the described method blocks can be combined in any order to implement a method, or an alternate method.

At block 502, light is emitted from an emitter structure in an imaging unit. For example, the imaging unit 202 (FIG. 2) includes the emitter structure 206, which can be implemented as individual embedded light sources that direct emit light, and the individual embedded light sources cycle to direct emit the light one at a time. At block 504, the light is directed along a light path with optics to illuminate a projection surface in the imaging unit. For example, the optics in the imaging unit 202, such as the reflecting mirror 210, directs the light along a light path to illuminate the projection surface 212.

At block 506, a portion of the light is reflected to illuminate a light sensor. For example, the reflective panel 220 in the imaging unit 202 reflects a portion of the light at the collection lens 222 to illuminate the light sensor 218. In implementations, the light sensor may be a linear array of light detectors positioned along one or more edges of the projection surface 212. At block 508, sensor data is received from the light sensor. For example, an imaging application 624 (shown in FIG. 6) receives the sensor data 616 from the light sensor 218, where the sensor data corresponds to the emitted light output from the emitter structure. In implementations, the sensor data is received from a linear array of the light detectors.

At block 510, a correction value is computed for each of the individual embedded light sources of the emitter structure over a time duration. For example, the imaging application 624 computes a correction value for each of the individual emitters (e.g., embedded light sources) of the emitter structure 206. At block 512, a calibration input to the emitter structure is initiated to adjust the emitted light output from the emitter structure and, at block 514, the emitted light output is adjusted for each individual embedded light source of the emitter structure. For example, the imaging application 620 initiates the calibration input for each of the individual embedded light sources to adjust the emitted light output. Further, the calibration input corrects for operational conditions that affect the emitted light output from the emitter structure, such as temperature, ambient light, and other environmental or operational conditions.

FIG. 6 illustrates various components of an example device 600 that can be implemented as any of the devices described with reference to the previous FIGS. 1-5, such as a wearable display device and/or a controller for a wearable display device. In embodiments, the device may be implemented as any one or combination of a fixed or mobile device, in any form of a consumer, computer, portable, communication, phone, navigation, appliance, gaming, media playback, and/or electronic device. The device may also be associated with a user (i.e., a person) and/or an entity that operates the device such that a device describes logical devices that include users, software, firmware, hardware, and/or a combination of devices.

The device 600 includes communication devices 602 that enable wired and/or wireless communication of device data 604, such as virtual image data, as well as video and images data, and other media content stored on the device. The media content stored on the device can include any type of audio, video, and/or image data. The device includes one or more data inputs 606 via which any type of data, media content, and/or inputs can be received, such as user-selectable inputs and any other type of audio, video, and/or image data received from any content and/or data source.

The device 600 also includes communication interfaces 608, such as any one or more of a serial, parallel, network, or wireless interface. The communication interfaces provide a connection and/or communication links between the device and a communication network by which other electronic, computing, and communication devices communicate data with the device.

The device 600 includes one or more processors 610 (e.g., any of microprocessors, controllers, and the like) or a processor and memory system (e.g., implemented in an SoC), which process computer-executable instructions to control the operation of the device. Alternatively or in addition, the device can be implemented with any one or combination of software, hardware, firmware, or fixed logic circuitry that is implemented in connection with processing and control circuits which are generally identified at 612. Although not shown, the device can include a system bus or data transfer system that couples the various components within the device. A system bus can include any one or combination of different bus structures, such as a memory bus or memory controller, a peripheral bus, a universal serial bus, and/or a processor or local bus that utilizes any of a variety of bus architectures.

The device 600 also includes one or more memory devices 614 (e.g., computer-readable storage media) that enable data storage, such as random access memory (RAM), non-volatile memory (e.g., read-only memory (ROM), flash memory, etc.), and a disk storage device. A disk storage device may be implemented as any type of magnetic or optical storage device, such as a hard disk drive, a recordable and/or rewriteable disc, and the like. The device may also include a mass storage media device. Computer-readable storage media can be any available medium or media that is accessed by a computing device.

A memory device 614 provides data storage mechanisms to store the device data 604, sensor data 616 from calibration sensors 618, other types of information and/or data, and device applications 620. For example, an operating system 622 can be maintained as a software application with the memory device and executed on the processors. The device applications may also include a device manager or controller, such as any form of a control application, software application, signal processing and control module, code that is native to a particular device, a hardware abstraction layer for a particular device, and so on. In this example, the device applications also include an imaging application 622 that may implement embodiments of imaging structure emitter calibration as described herein.

The device 600 may also include an audio and/or video processing system 626 that generates audio data for an audio system 628 and/or generates display data for a display system 630. In implementations, the audio system and/or the display system are external components to the device. Alternatively, the audio system and/or the display system are integrated components of the example device.

Although embodiments of imaging structure emitter calibration have been described in language specific to features and/or methods, the appended claims are not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed as example implementations of imaging structure emitter calibration. 

The invention claimed is:
 1. An imaging unit, comprising: an emitter structure configured to direct emit light; optics configured to direct the light along a light path in the imaging unit; a projection surface that the optics direct the light along the light path to illuminate, the projection surface being an electrically alterable mirror configured to scan in at least one dimension to reflect the light through an imaging optic that directs the light into a display optic; a reflective panel configured to reflect a portion of the light directed by the projection surface to illuminate a light sensor, the reflective panel positioned proximal to the imaging optic allowing the portion of the light to be reflected at a beginning position or an end position of the scan in the at least one direction of the projection surface; and an imaging application configured to receive sensor data from the light sensor, the sensor data corresponding to emitted light output from the emitter structure, and the imaging application further configured to initiate a calibration input to the emitter structure to adjust the emitted light output from the emitter structure.
 2. An imaging unit as recited in claim 1, wherein the emitter structure comprises individual embedded light sources configured to direct emit the light, and wherein the calibration input adjusts the emitted light output from an individual embedded light source of the emitter structure.
 3. An imaging unit as recited in claim 2, wherein the imaging application is configured to compute a correction value for each of the individual embedded light sources of the emitter structure over a time duration.
 4. An imaging unit as recited in claim 2, wherein the individual embedded light sources are configured to cycle to direct emit the light one at a time, and wherein the imaging application is configured to initiate the calibration input for each individual embedded light source.
 5. An imaging unit as recited in claim 1, wherein the calibration input to the emitter structure corrects for operational conditions that affect the emitted light output from the emitter structure.
 6. An imaging unit as recited in claim 1, wherein the light sensor is positioned proximate the projection surface in the imaging unit.
 7. An imaging unit as recited in claim 1, wherein the light sensor comprises a linear array of light detectors, and wherein the imaging application is configured to receive the sensor data from the linear array of light detectors.
 8. An imaging structure as recited in claim 1, wherein the emitter structure comprises a one-dimensional or two-dimensional array of individual embedded light sources formed in inorganic material as one of lasers or LEDs to direct emit the light.
 9. A method, comprising: emitting light from an emitter structure in an imaging unit; directing the light along a light path with optics to illuminate a projection surface in the imaging unit, the projection surface being an electrically alterable mirror configured to scan in at least one dimension to reflect the light through an imaging optic that directs the light into a display optic; reflecting a portion of the light directed by the projection surface to illuminate a light sensor using a reflective panel positioned proximal to the imaging optic allowing the portion of the light to be reflected at a beginning position or an end position of the scan in the at least one direction of the projection surface; receiving sensor data from the light sensor, the sensor data corresponding to emitted light output from the emitter structure; and initiating a calibration input to the emitter structure to adjust the emitted light output from the emitter structure.
 10. A method as recited in claim 9, further comprising adjusting the emitted light output of each individual embedded light source of the emitter structure.
 11. A method as recited in claim 10, further comprising computing a correction value for each of the individual embedded light sources of the emitter structure over a time duration.
 12. A method as recited in claim 10, wherein the individual embedded light sources of the emitter structure cycle to direct emit the light one at a time, and wherein the calibration input is said initiated for each individual embedded light source.
 13. A method as recited in claim 9, wherein the calibration input corrects for operational conditions that affect the emitted light output from the emitter structure.
 14. A method as recited in claim 9, wherein the light sensor comprises a linear array of light detectors, and wherein the sensor data is said received from the linear array of light detectors.
 15. A method, comprising: generating an augmented reality image with imaging units, each of the imaging units comprising: optics directing light along a light path to illuminate a projection surface that is an electrically alterable mirror configured to scan in at least one dimension to reflect the light through an imaging optic that directs the light into a display optic; a reflective panel reflecting a portion of the light directed by the projection surface to illuminate a light sensor that generates sensor data corresponding to emitted light output from an emitter structure, the reflective panel positioned proximal to the imaging optic allowing the portion of the light to be reflected at a beginning position or an end position of the scan in the at least one direction of the projection surface; and calibrating the emitter structure to adjust the emitted light output from the emitter structure.
 16. A method as recited in claim 15, wherein the light sensor comprises a linear array of light detectors.
 17. A method as recited in claim 15, further comprising: receiving the sensor data from each light sensor of the respective imaging units; and generating a calibration input to the emitter structure in each of the respective imaging units to adjust the emitted light output from the emitter structures.
 18. A method as recited in claim 17, wherein the calibration input to the emitter structure corrects for operational conditions that affect the emitted light output from the emitter structure.
 19. A method as recited in claim 17, wherein the emitter structure comprises individual embedded light sources configured to direct emit the light, and wherein the calibration input adjusts the emitted light output from an individual embedded light source of the emitter structure.
 20. A method as recited in claim 19, further comprising: computing a correction value for each of the individual embedded light sources of the emitter structure over a time duration. 